(1) Bluetooth audio SoC chip series
①Bluetooth speaker SoC chip series
The company is one of the important suppliers of SoC chips for Bluetooth speakers in the world. Thanks to the continuous improvement of the company’s product competitiveness and the market opportunities under the general trend of domestic substitution, the Bluetooth speaker chip has become the company’s current main product and an important source of income. In the field of bluetooth speakers, the company has become a mainstream supplier of industry terminal brands and has achieved domestic substitution of mid-to-high-end bluetooth speaker SoCs. The company mainly serves first- and second-tier terminal brands at home and abroad, including Anker Innovation, Huawei, Xiaomi, Harman, SONY, Logitech and many other terminal brands. By providing a series of chip combinations with differentiated matching, it can meet the differentiation of terminal brands in the market. It has been widely recognized by mainstream terminal brands and ODM/OEM foundries in the industry.
While the portable bluetooth speaker market is stabilizing, the soundbar market is growing steadily. According to a technavio research report, the soundbar market will grow at a compound annual growth rate of 15% from 2020 to 2024. Actions will enter the soundbar market in 2021. Supply chain of well-known brand customers such as SONY and Vizio. At the same time, the company is also actively deploying differentiated market segments. The company’s products will enter the supply chain of RODE, the leading wireless microphone brand, in 2021.
In 2021, with strong technical strength, the company’s Bluetooth speaker SoC chip series will continue to penetrate domestic and foreign terminal brands at a relatively high growth rate.
②Bluetooth headset SoC chip series
The TWS Bluetooth headset SoC chip is the company’s first landing point in the Bluetooth wearable market. Counterpoint Research’s latest report shows that global shipments of TWS headsets will reach 299.6 million units in 2021, close to 300 million units, and shipments will increase by 24% year-on-year.
In 2021, the company will launch an upgraded chip of the ATS301X series supporting single and dual microphone ENC and ATS302X series chip supporting ANC and LE Auido for the TWS Bluetooth headset market. There are new upgrades in all aspects, and it is a very competitive solution for mainstream products such as mobile phone brands, professional audio brands and e-commerce brands in the market. It has the latest Bluetooth 5.3 dual-mode configuration, which effectively improves the stability of audio connections on the basis of low power consumption, and supports low-latency mode, with Bluetooth audio signal latency as low as 50ms. For the call experience, it has been upgraded to the AI call noise reduction algorithm, and the audio noise floor performance has reached the industry’s highest level of 2 microvolts.
The company’s TWS Bluetooth headset SoC chip will enter the supply chain of terminal headset brands such as realme, JBL, Baseus, Baidu, TOZO, Nosie, and Black Shark in 2021. At the same time, the company actively deploys differentiated markets, such as Bluetooth headsets, wireless gaming headsets and Bluetooth auxiliary listening headsets. During the reporting period, the company’s TWS Bluetooth headset revenue continued to grow rapidly.
Post time: Aug-02-2022
